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HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188
March 2001
GENERAL DESCRIPTION
The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus specifications. In addition to being functional upgrades of Holt's HI-8382 & HI-8383 products, they are also alternate sources for the HS-3182 ( Intersil/Harris), the RM3182 (Fairchild /Raytheon) and a variety of similar DEI/DDC line driver products. Inputs are provided for clocking and synchronization. These signals are AND'd with the DATA inputs to enhance system performance and allow the HI-318X series of products to be used in a variety of applications. Both logic and synchronization inputs feature built-in 2,000V minimum ESD input protection as well as TTL and CMOS compatibility. The differential outputs of the HI-318X series of products are independently programmable to either the high speed or low speed ARINC 429 output rise and fall time specifications through the use of two external capacitors. The output voltage swing is also adjustable by the application of an external voltage to the VREF input. Products with 0, 13 or 37.5 ohm resistors in series with each ARINC output are available. In addition, the HI-3182, HI-3184 and HI-3187 products also have a fuse in series with each output. The HI-318X series of line drivers are intended for use where logic signals must be converted to ARINC 429 levels such as when using an ASIC, the HI-8282 ARINC 429 Serial Transmitter/Dual Receiver, the HI-6010 ARINC 429 Transmitter/Receiver or the HI-8783 ARINC Interface Device. Holt products are readily available for both industrial and military applications. Please contact the Holt Sales Department for additional information.
PIN CONFIGURATION
VREF 1 GND (See Note * ) 2 SYNC 3 DATA (A) 4 CA 5 AOUT 6 -V 7 14 V1
(Top View)
13 CLOCK 12 DATA (B) 11 CB 10 BOUT 9 +V 8 GND
HI-3184PS, HI-3185PS, HI-3186PS & HI-3187PS
14 - PIN PLASTIC SMALL OUTLINE (ESOIC)**
Notes: * Pin 2 may be left floating ** Thermally Enhanced SOIC Package
(See Page 5 for additional package pin configurations)
FUNCTION +
FEATURES
! Low power CMOS ! TTL and CMOS compatible inputs ! Programmable output voltage swing ! Adjustable ARINC rise and fall times ! Plastic 14 & 16-pin thermally enhanced SOIC packages available ! Pin-for-Pin alternative for DEI/DDC/Intersil/Fairchild applications ! Operates at data rates up to 100 Kbits ! Overvoltage protection ! Industrial and Military temperature ranges
ARINC 429 DIFFERENTIAL LINE DRIVER
TRUTH TABLE
SYNC CLOCK DATA(A) DATA(B) AOUT X L H H H H L X H H H H X X L L H H X X L H L H 0V 0V 0V -VREF +VREF 0V BOUT COMMENTS 0V 0V 0V +VREF -VREF 0V NULL NULL NULL LOW HIGH NULL
(DS3182 Rev. B )
HOLT INTEGRATED CIRCUITS 1
03/01
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
FUNCTIONAL DESCRIPTION
The SYNC and CLOCK inputs establish data synchronization utilizing two AND gates, one for each data input. Each logic input, including the power enable (STROBE) input, are TTL/CMOS compatible. Figure 1 illustrates a typical ARINC 429 bus application. Three power supplies are necessary to operate the HI-3182; typically +15V, -15V and +5V. The chip also works with 12V supplies. The +5V supply can also provide a reference voltage that determines the output voltage swing. The differential output voltage swing will equal 2VREF. If a value of VREF other than +5V is needed, a separate +5V power supply is required for pin V1. With the DATA (A) input at a logic high and DATA (B) input at a logic low, AOUT will switch to the +VREF rail and BOUT will switch to the -VREF rail (ARINC HIGH state). With both data input signals at a logic low state, the outputs will both switch to 0V (ARINC NULL state). The driver output impedance, ROUT, is nominally 75, 26 or 0 ohms depending on the option chosen. The rise and fall times of the outputs can be calibrated through the selection of two external capacitor values that are connected to the CA and CB input pins. Typical values for high-speed operation (100KBPS) are CA = CB = 75pF and for low-speed operation (12.5 to 14KBPS) CA = CB = 500pF. The CA and CB pins swing between +5V and ground allowing the switching of capacitor values with an external singlesupply analog switch. The ARINC outputs can be put in a tri-state mode by applying a logic high to the STROBE input pin. If this feature is not being used, the pin should be tied to ground. The STROBE function is not available in the 14 & 16-pin SOIC package configurations where the pin is internally connected to ground. The ARINC outputs of the HI-3182, HI-3184 and HI-3187 are protected by internal fuses capable of sinking between 800 900 mA for short periods of time (125s).
+5V
+15V
VREF
DATA (A)
V1 SYNC CLOCK
OUT
+V
INPUTS
DATA (B)
C C STROBE GND -V
TO ARINC BUS
B
-15V
Figure 1. ARINC 429 BUS APPLICATION
REF
+V
CA
Shorted on HI-3186, HI-3187, HI-3188
DATA (A) LEVEL SHIFTER AND SLOPE CONTROL (A) CLOCK 24.5 OUTPUT DRIVER (A) CL SYNC LEVEL SHIFTER AND SLOPE CONTROL (B) 24.5 OUTPUT DRIVER (B) RL 13 FA
13
FB
DATA (B)
V1
STROBE
CURRENT REGULATOR
Shorted on HI-3183, HI-3186 HI-3187, HI-3188
Shorted on HI-3183, HI-3185 HI-3186, HI-3188
GND
-V
CB
B OUT
Figure 2. FUNCTIONAL BLOCK DIAGRAM
HOLT INTEGRATED CIRCUITS 2
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
SYMBOL
VREF STROBE SYNC DATA (A) CA AOUT -V GND +V BOUT CB DATA (B) CLOCK V1
FUNCTION
POWER INPUT INPUT INPUT INPUT OUTPUT POWER POWER POWER OUTPUT INPUT INPUT INPUT POWER
DESCRIPTION
Reference voltage used to determine the output voltage swing A logic high tri-states the ARINC outputs. Not available in the 14-pin SOIC package (tied to GND internally). Synchronizes data inputs Data input terminal A Connection for DATA (A) slew-rate capacitor ARINC output terminal A -12V to -15V 0.0V +12V to +15V ARINC output terminal B Connection for DATA (B) slew-rate capacitor Data input terminal B Synchronizes data inputs +5V 5%
All Voltages referenced to GND, TA = Operating Temperature Range (unless otherwise specified)
PARAMETER
Differential Voltage Supply Voltage
SYMBOL
VDIF +V -V V1 VREF VIN
CONDITIONS
Voltage between +V and -V terminals
OPERATING RANGE
MAXIMUM
40
UNIT
V V V V V V V V
+10.8 to +16.5 -10.8 to -16.5 +5 10% For ARINC 429 For Applications other than ARINC +5 5% 0 to 6
+7 6 6 > GND -0.3 < V1 +0.3
Voltage Reference Input Voltage Range Output Short-Circuit Duration Output Overvoltage Protection Operating Temperature Range Storage Temperature Range Lead Temperature Junction Temperature
See Note: 1 See Note: 2 TA TSTG Hi-temp & Military Industrial Ceramic & Plastic Soldering, 10 seconds TJ -55 to +125 -40 to +85 -65 to +150 +275 +175 C C C C C
Note 1. Heatsinking may be required for Output Short Circuit at +125C and for 100KBPS at +125C. Note 2. The fuses used for Output Overvoltage Protection may be blown by the presence of a voltage at either output that is greater than 12.0V with respect to GND. (HI-3182, 3184 & 3187 only) NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
HOLT INTEGRATED CIRCUITS 3
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
+V = +15V, -V = -15V, V1 = VREF = +5.0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
Supply Current +V (Operating) Supply Current -V (Operating) Supply Current V1 (Operating) Supply Current VREF (Operating) Supply Current +V (During Short Circuit Test) Supply Current -V (During Short Circuit Test) Output Short Circuit Current (Output High) Output Short Circuit Current (Output Low) Input Current (Input High) Input Current (Input Low) Input Voltage High Input Voltage Low Output Voltage High (Output to Ground) Output Voltage Low (Output to Ground) Output Voltage Null Input Capacitance
SYMBOL ICCOP (+V) ICCOP (-V) ICCOP (V1) ICCOP (VREF) ISC (+V) ISC (-V) IOHSC IOLSC IIH IIL VIH VIL VOH VOL VNULL CIN
No Load No Load No Load
CONDITION
(0 - 100KBPS) (0 - 100KBPS) (0 - 100KBPS)
MIN
-16
TYP
MAX UNITS
+16 500 mA mA A mA 150 mA mA -80 mA mA 1.0 A A V 0.5 V V V mV pF +VREF +.25 -VREF +.25 +250
No Load, VREF = 5V (0 - 100KBPS) Short to Ground Short to Ground Short to Ground Short to Ground (See Note: 1) (See Note: 1)
-1.0 -150 +80 -1.0 2.0
VMIN=0 (See Note: 2) VMIN=0 (See Note: 2)
No Load No Load No Load
See Note 1
(0 -100KBPS) (0 -100KBPS) (0-100KBPS)
+VREF -.25 -VREF -.25 -250 15
Note 1. Not tested, but characterized at initial device design and after major process and/or design change which affects this parameter. Note 2. Interchangeability of force and sense is acceptable.
+V = +15V, -V = -15V, V1 = VREF = +5.0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
Rise Time ( A OUT , B OUT ) Fall Time ( A OUT , B OUT ) Propagtion Delay Input to Output Propagtion Delay Input to Output
SYMBOL tR tF t PLH t PHL
CONDITION C A = C B = 75pF C A = C B = 75pF C A = C B = 75pF C A = C B = 75pF
See Figure 3. See Figure 3. See Figure 3. See Figure 3.
MIN
1.0 1.0
TYP
MAX UNITS
2.0 2.0 3.0 3.0
2.0V 0.5V
s s s s
DATA (A) 0V DATA (B) 0V VREF
50%
50% ADJUST BY CA
2.0V 0.5V
+4.75V to +5.25V
AOUT 0V
ADJUST BY CA
-VREF
50% 50%
-4.75V to -5.25V
ADJUST BY CB ADJUST BY CB
tPHL
+VREF
+4.75V to +5.25V -4.75V to -5.25V
HIGH NULL
BOUT 0V
-VREF
tPLH
tR
DIFFERENTIAL OUTPUT 0V
2VREF
+9.5V to +10.5V
(AOUT - BOUT)
NOTE: OUTPUTS UNLOADED
tF
-2VREF
LOW
-9.5V to -10.5V
Figure 3. SWITCHING WAVEFORMS
HOLT INTEGRATED CIRCUITS 4
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
ADDITIONAL PIN CONFIGURATIONS (See page 1 for 14-Pin Small Outline SOIC)
HI-3182PS, HI-3183PS, HI-3188PS
VREF - 1 GND (See Note * ) - 2 SYNC - 3 DATA(A) - 4 CA - 5 AOUT - 6 -V - 7 GND - 8 16 - V1
4 3 2 1 28 27 26
16 - PIN PLASTIC SMALL OUTLINE (ESOIC)**
15 - N/C 14 - CLOCK 13 - DATA(B) 12 - CB 11 - BOUT 10 - N/C 9 - +V
N/C DATA (A) N/C N/C CA N/C N/C
5 6 7 8 9 10 11
HI-3182PJ 24 HI-3183PJ 23
28 - PIN PLASTIC PLCC
12 13 14 15 16 17 18 22 21 20 19
25
CLOCK N/C DATA (B) CB N/C N/C N/C
Notes: * Pin 2 may be left floating ** Thermally Enhanced SOIC package
29 28 27 26 25 24 23 22 21
4 20
3
2
1 28 27 26 25 24 23 22
CLOCK V1 N/C VREF STROBE SYNC N/C
30 31 32 1 2 3 4 56
HI-3182CR HI-3183CR
32 - PIN CERQUAD
7 8 9 10 11 12 13
19 18 17 16 15 14
N/C N/C +V GND N/C -V N/C
N/C 5 DATA (A) 6 N/C 7 N/C 8 CA 9 N/C 10 N/C 11
HI-3182CL HI-3183CL 28 - PIN CERAMIC LCC
CLOCK N/C
DATA (B) CB 21 N/C
20
19 12 13 14 15 16 17 18
N/C N/C
VREF 1 STROBE 2
16 V1 15 N/C 14 CLOCK 13 DATA(B) 12 CB 11 BOUT 10 N/C 9 +V
HI-3182CD HI-3183CD
16 - PIN CERAMIC DIP
SYNC 3 DATA(A) 4 CA 5 AOUT 6 -V 7 GND 8
HOLT INTEGRATED CIRCUITS 5
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
ORDERING INFORMATION
PART PACKAGE TEMPERATURE OUTPUT SERIES BURN LEAD
NUMBER HI-3182CDI
DESCRIPTION 16 PIN CERAMIC SIDE BRAZED DIP
RANGE -40C TO +85C -55C TO +125C -55C TO +125C
RESISTANCE 37.5 37.5 37.5 37.5 37.5 37.5 37.5 37.5 37.5 37.5 37.5 37.5 13 13 13 13 13 13 13 13 13 13 13 13 37.5 37.5 37.5 37.5 0 0 0 0 0 0
FUSE YES YES YES YES YES YES YES YES YES YES YES YES NO NO NO NO NO NO NO NO NO NO NO NO YES YES NO NO NO NO YES YES NO NO
FLOW I T M I T M I T I T I T I T M I T M I T I T I T I T I T I T I T I T
IN NO NO YES NO NO YES NO NO NO NO NO NO NO NO YES NO NO YES NO NO NO NO NO NO NO NO NO NO NO NO NO NO NO NO
FINISH GOLD GOLD SOLDER GOLD GOLD SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER GOLD GOLD SOLDER GOLD GOLD SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER SOLDER
HI-3182CDT 16 PIN CERAMIC SIDE BRAZED DIP HI-3182CDM 16 PIN CERAMIC SIDE BRAZED DIP HI-3182CLI
28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -40C TO +85C
HI-3182CLT 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55C TO +125C HI-3182CLM 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55C TO +125C HI-3182CRI HI-3182PJI HI-3182PJT 32 PIN J-LEAD CERQUAD 28 PIN PLASTIC J -LEAD PLCC 28 PIN PLASTIC J -LEAD PLCC -40C TO +85C -55C TO +125C -40C TO +85C -55C TO +125C -40C TO +85C -55C TO +125C -40C TO +85C -55C TO +125C -55C TO +125C HI-3182CRT 32 PIN J-LEAD CERQUAD
HI-3182PSI 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC) HI-3182PST 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC) HI-3183CDI 16 PIN CERAMIC SIDE BRAZED DIP HI-3183CDT 16 PIN CERAMIC SIDE BRAZED DIP HI-3183CDM 16 PIN CERAMIC SIDE BRAZED DIP HI-3183CLI
28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -40C TO +85C
HI-3183CLT 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55C TO +125C HI-3183CLM 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55C TO +125C HI-3183CRI 32 PIN J-LEAD CERQUAD HI-3183CRT 32 PIN J-LEAD CERQUAD HI-3183PJI HI-3183PJT HI-3183PSI 28 PIN PLASTIC J -LEAD PLCC 28 PIN PLASTIC J -LEAD PLCC 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC) -40C TO +85C -55C TO +125C -40C TO +85C -55C TO +125C -40C TO +85C -55C TO +125C -40C TO +85C -55C TO +125C -40C TO +85C -55C TO +125C -40C TO +85C -55C TO +125C -40C TO +85C -55C TO +125C -40C TO +85C -55C TO +125C
HI-3183PST 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC) HI-3184PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) HI-3184PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) HI-3185PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) HI-3185PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) HI-3186PSI HI-3187PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) HI-3186PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) HI-3187PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) HI-3188PSI 16 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) HI-3188PST 16 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
Legend: ESOIC - Thermally Enhanced Small Outline Package (SOIC w/built-in heat sink) NB - Narrow Body WB - Wide Body
HOLT INTEGRATED CIRCUITS 6
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
14-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB (Narrow Body, Thermally Enhanced)
.3406 .0039 (8.651 .099) .00865 .00115 (.220 .029)
Package Type: 14H 14HNE
.280 TYP. (7.112) TYP.
.236 .008 (6.00 .20)
Top View
.1535 .0035 (3.899 .089)
.110 TYP. (2.794) TYP.
Bottom View
.0165 .0035 (.419 ..089)
Detail A
.061 .007 (1.549 .178)
Heat sink stud on bottom of package
0 to 8
.050 .010 (1.270 .254) .033 .017 (.838 .432)
Detail A
.0069 .0029 (.175 .074)
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB (Narrow Body, Thermally Enhanced)
.3898 .0039 (9.901 .099) .00865 .00115 (.220 .029)
Package Type: 16HNE
.280 TYP. (7.112) TYP.
.236 .008 (6.00 .20)
Top View
.1535 .0035 (3.899 .089)
.110 TYP. (2.794) TYP.
Bottom View
Heat sink stud on bottom of package
.0165 .0035 (.419 ..089)
Detail A
.061 .007 (1.549 .178)
0 to 8
.050 .010 (1.270 .254) .033 .017 (.838 .432)
Detail A
.0069 .0029 (.175 .074)
HOLT INTEGRATED CIRCUITS 7
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB (Wide Body, Thermally Enhanced)
.405 .008 (10.287 .203) .0105 .0015 (.2667 .0381)
Package Type: 16HWE
.240 .010 (6.096 .254)
.4065 .0125 (10.325 .318)
Top View
.295 .004 (7.493 .102)
.190 .010 (4.826 .254)
Bottom View
Detail A
Heat sink stud on bottom of package
.090 .010 (2.286 .254)
0 to 8
.050 .010 (1.270 .254) .0165 .0035 (.4191 .0889) .033 .017 (.838 .432)
.0025 .0015 (.0635 .0381)
Detail A
16-PIN CERAMIC SIDE-BRAZED DIP
Package Type: 16C
.810 MAX (20.574 MAX)
.295 .010 (7.493 .254) .050 .005 (1.270 .127) .035 .010 (.889 .254) BASE PLANE .125 MIN (3.175 MIN) .018 .002 (.457 .051) SEATING PLANE .100 BSC (2.540 BSC) .300 .010 (7.620 .254)
PIN 1 .200 MAX (5.080 MAX)
.010 .002 (.254 .051)
HOLT INTEGRATED CIRCUITS 8
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
28-PIN PLASTIC PLCC
Package Type: 28J
PIN NO. 1 .045 x 45 PIN NO. 1 IDENT .045 x 45 .050 .005 (1.27 .127) .031 .005 (.787 .127)
.490 .005 (12.446 .127) SQ.
.453 .003 (11.506 .076) SQ.
.017 .004 (.432 .102) SEE DETAIL A
.009 .011 .015 .002 (.381 .051) .020 MIN (.508 ) R .025 .045
.173 .008 (4.394 .203) DETAIL A .410 .020 (10.414 .508)
28-PIN CERAMIC LEADLESS CHIP CARRIER
Package Type: 28S
.020 INDEX (.508 INDEX)
PIN 1
.080 .020 (2.032 .508)
PIN 1
.050 .005 (1.270 .127) .451 .009 (11.455 .229) SQ. .050 BSC (1.270 BSC) .008R .006 (.203R .152) .040 x 45 3PLS (1.016 x 45 3PLS) .025 .003 (.635 .076)
HOLT INTEGRATED CIRCUITS 9
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
32-PIN J-LEAD CERQUAD
Package Type: 32U
31 32 1 2
.450 .008 (11.430 .203) .488 .008 (12.395 .203)
.420 .012 (10.668 .305)
.588 .008 (14.935 .203) .550 .009 (13.970 .229) .190 MAX. (4.826) MAX. .083 .009 (2.108 .229)
.040 TYP. (1.016) TYP. .019 .003 .050 TYP. (.483 .076) (1.270) TYP. .520 .012 (13.208 .305)
HOLT INTEGRATED CIRCUITS 10

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